News
LIG Nex1 and BOS Semiconductors sign MOU on physical AI solutions for drones and robots
2025.12.18
• Physical AI and on-device AI technologies set to drive innovation in intelligent drone and robot technologies
• Leading promotion of the competitiveness of domestic AI semiconductors and revitalization of the AI semiconductor business in national defense and civilian sectors
LIG Nex1 signed a strategic Memorandum of Understanding (MOU) with BOS Semiconductors, a Korean fabless semiconductor company, to expedite the development and commercialization of physical AI solutions for drones and robots.
BOS Semiconductors is a domestic company specializing in the design of semiconductors for automobiles, robots, and physical AI. The MOU was signed for full-scale cooperation for physical AI and on-device AI to drive innovation in drone and robot technologies.
Based on the MOU, the two companies will enhance their cooperation on developing physical AI semiconductors, drones, and robots, applying the semiconductors and high-performance system-on-chip (SoC) to be used on next-generation drones and robots.
Physical AI is a technology that enables devices to perceive, make decisions, and move in their own physical space through AI models installed in them. It can also reduce dependency on cloud computing through perception, inference, and control on the devices in real time, thereby minimizing latency and substantially increasing security and power efficiency.
Due to such characteristics, physical AI is emerging as a basic technology that satisfies major requirements of robots and drones operating autonomously in an unmanned environment and is hailed as a key next-generation technology paradigm.
Based on their collaboration, LIG Nex1 and BOS Semiconductors plan to improve technological competitiveness in AI semiconductors optimized for drone and robot platforms and high-performance SoC, leading the development of advanced intelligent unmanned systems in various areas, including defense, industry, and logistics in the future.
LIG Nex1 is working on the development of next-generation robot and drone systems applying the on-device AI semiconductor, a key component of unmanned mobility devices such as drones, robots, and humanoids that will incorporate physical AI. It will also consider the applicability to new high-performance SoC-based platforms in addition to AI semiconductors, further accelerating technological innovation in unmanned systems.
Kim Jin-hoon, head of LIG Nex1’s D2C Research Center, said, “Based on the collaboration, we can drastically reduce dependency on foreign AI semiconductors through domestic manufacturing of on-device AI semiconductors and high-performance SoC, which are key components of unmanned mobility devices. We expect that it will provide strategic momentum to build competitiveness of local AI semiconductor manufacturers and facilitate the AI semiconductor industry in defense and civil domains.”
• Leading promotion of the competitiveness of domestic AI semiconductors and revitalization of the AI semiconductor business in national defense and civilian sectors
LIG Nex1 signed a strategic Memorandum of Understanding (MOU) with BOS Semiconductors, a Korean fabless semiconductor company, to expedite the development and commercialization of physical AI solutions for drones and robots.
BOS Semiconductors is a domestic company specializing in the design of semiconductors for automobiles, robots, and physical AI. The MOU was signed for full-scale cooperation for physical AI and on-device AI to drive innovation in drone and robot technologies.
Based on the MOU, the two companies will enhance their cooperation on developing physical AI semiconductors, drones, and robots, applying the semiconductors and high-performance system-on-chip (SoC) to be used on next-generation drones and robots.
Physical AI is a technology that enables devices to perceive, make decisions, and move in their own physical space through AI models installed in them. It can also reduce dependency on cloud computing through perception, inference, and control on the devices in real time, thereby minimizing latency and substantially increasing security and power efficiency.
Due to such characteristics, physical AI is emerging as a basic technology that satisfies major requirements of robots and drones operating autonomously in an unmanned environment and is hailed as a key next-generation technology paradigm.
Based on their collaboration, LIG Nex1 and BOS Semiconductors plan to improve technological competitiveness in AI semiconductors optimized for drone and robot platforms and high-performance SoC, leading the development of advanced intelligent unmanned systems in various areas, including defense, industry, and logistics in the future.
LIG Nex1 is working on the development of next-generation robot and drone systems applying the on-device AI semiconductor, a key component of unmanned mobility devices such as drones, robots, and humanoids that will incorporate physical AI. It will also consider the applicability to new high-performance SoC-based platforms in addition to AI semiconductors, further accelerating technological innovation in unmanned systems.
Kim Jin-hoon, head of LIG Nex1’s D2C Research Center, said, “Based on the collaboration, we can drastically reduce dependency on foreign AI semiconductors through domestic manufacturing of on-device AI semiconductors and high-performance SoC, which are key components of unmanned mobility devices. We expect that it will provide strategic momentum to build competitiveness of local AI semiconductor manufacturers and facilitate the AI semiconductor industry in defense and civil domains.”